BPDA CAS# 2420-87-3

1.High Heat Resistance: Delivers reliable performance in hightemperature scenarios, ideal for heatresistant wires, heating elements and satellite thermal control films.

2.Excellent Electrical Performance: Well suited for TAB, COF, FPC and printed circuit boards, ensuring stable insulation and consistent signal transmission.

3.Strong Mechanical Support: Provides outstanding strength and rigidity for FPC stiffeners, metallic substrates and heavyduty electrical machinery.

4.Wide Application Compatibility: Applicable to electronics, solar cells, speaker diaphragms and office automation equipment, featuring extensive industrial versatility.

Product Details

Applications of 3,3′,4,4′-Biphenyltetracarboxylic Dianhydride

Used in tape automated bonding (TAB), chip-on-film (COF), lead lock tapes, and high-density flexible printed circuits (FPC), including FPC stiffeners. It is also applied in office automation equipment, flexible solar cells, speaker diaphragms for mobile phones, plasma TVs, and automotive audio systems, as well as in heavy electrical machinery. Additional applications include satellite thermal control films, printed circuit boards, metal substrates, sheet-type heating elements, and heat-resistant wires.

English Name3,3',4,4'-Biphenyltetracarboxylic dianhydride
English Synonyms3,3',4,4'-Biphenyl tetracarboxylic diandhydride;[1,1'-Biphenyl]-3,3',4,4'-tetracarboxylic3,4:3',4'-dianhydride; 3,4,3',4'-Biphenyltetracarboxylic acid dianhydride;3,3',4,4'-Biphenyltetracarboxylic dianhydride 97%6;4,4'-Bip hthalic Anhydride (purified by sublimation);3,3'4,4'-Biphenyl tetracarboxylic acid dianhydride(s-BPDA);S-BD PA;S-BPDA
CAS Number2420-87-3
Molecular FormulaC16H606
Molecular Weight294.22
EINECS Number219-342-9
Melting point299-305 °C (lit.)
Boiling point614.9±48.0 °C(Predicted)
Density1.625±0.06 g/cm3(Predicted)
Vapor pressureOPa at 20℃
Storage conditionsInert atmosphere,Room Temperature
SolubilityAlmost transparent in hot DMF
FormPowder crystals
ColorOff-white
Maximum wavelength (λmax)300nm(lit.)
InChIInChI=1S/C16H6O6/c17-13-9-3-1-7(5-11(9)15(19)21-13)8-2-4-10-12(6-8)16(20)22-14(10)18/h1-6H
InChIKeyWKDNYTOXBCRNPV-UHFFFAOYSA-N
SmilesC1(=O)C2=C(C=C(C3C=CC4C(=O)OC(=O)C=4C=3)C=C2)C(=0)01
LogP3.91

BPDA CAS# 2420-87-3

BPDA CAS# 2420-87-3

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